Internal bond wire connections within an IC package, between a silicon chip and its external package pins. Sometimes high-volume, cost-sensitive applications (such as a calculator) wire bond a silicon chip directly to a PCB and cover with a blob of epoxy.
Wire bonding refers to the internal bond wire connections within an IC package, between a silicon chip and its external package pins. Sometimes high-volume, cost-sensitive applications (such as a calculator) wire bond a silicon chip directly to a PCB and cover with a blob of epoxy.
Bond wires are attached using various welding techniques in a process called "wire bonding". In mass production the wire bonding is performed by machine.
Bond wires are very narrow diameter (tens of micrometers, to hundreds of micrometers) with no insulation of their own, so care is required in the placement of the IC bond pads on the silicon chip, the contact location on the leadframe, and even the alignment of the silicon chip on the leadframe, to ensure that bond wires do not cross and have sufficient clearance. After wire bonding, non-conducting epoxy resin is typically used to encapsulate the assembly.
