Electrical Engineering Stack Exchange
Electrical Engineering Stack Exchange

Questions tagged [bga]

Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

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Why are there no BGA chips with triangular tessellation of circular pads (a "hexagonal grid")?

Ball grid arrays are advantageous integrated circuit packages when a high interconnect density and/or low parasitic inductance is paramount. However, they all use a rectangular grid. A triangular tiling would allow π⁄√12 or 90.69% of the footprint…
jms
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Getting started with PCB Layout for BGA Packages

Are there any good resources for learning the intricacies of PCB layout when dealing with BGA packages? I'm very familiar with layout for almost every SMT part that has leads on the edge (QFP, TSSOP, QFN, etc...) However, I have not ever had a…
Connor Wolf
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Can leaded BGA chips be reflow soldered with lead-free process?

We have a board with two BGA chips. Due to the current shortage of many parts, one of the chips is next-to-impossible to find; except that we found a supplier with a good stock of the non-RoHS / leaded version of the chip (which is a discontinued…
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DIY BGA soldering feasability

BGA seems to be somewhat of a showstopper for the diy community, especially with the newer more powerful parts being almost exclusively bga. I know it can be done with the skillet/toaster oven method, but it seems like there is no way of inspecting…
stbtra
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What mad solder type is used for BGA?

Having nothing to do in my workshop, I decided to practise my skills a bit. I digged up a scrapped graphics card from the junk box and decided to try to desolder the RAM-chips (BGA) after seeing how "easy" it looks when Louis Rossman does it. I…
bos
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Why does the underside of this flip-chip BGA have small notches in it?

I am reverse engineering an embedded system which has an ARM SoC on it. I have no datasheets at all, so I am going fairly deep with the investigation. It is packaged in a lidless flip-chip BGA. The carrier substrate that the die is mounted on…
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How to deal with LFBGA217 package when building prototype boards by hand

I am involved in a project in which I need to create a few prototype boards that will use the AT91SAM9G20B-CU processor in the LFBGA217_J package. Because this is a fine pitch BGA package, I'm not sure how to go about building prototypes that can be…
Chimera
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How to escape 0.5mm ball grid array pins?

I have a small hobby project in which I want to include the Kingston EMMC04G-M657 eMMC chip. This chip comes in BGA packaging with 0.5mm pitch between balls. I want my board to be cheap, so I'm laying it out for a 4-layer JLBPCB PCB using their…
Mr Squid
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Soldering BGA components DIY

If I understood correctly, current BGA components contain solder balls under the package. Do I still need additional solder paste to put on the board, or the amount of solder on the component contacts is sufficient?
Nazar
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Is it considered bad practice to put Vias on BGA pads?

I am routing a Spartan 6 BGA, I have seen a lot of people place the via next to the pad, can the Via be placed on the pad if its filled before the BGA is placed?
Alex
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Is it possible to hand-solder a BGA without solder balls

In an attempt to fix a short circuit on a BGA package, I ended up making things worse. The BGA is desoldered with some of the balls left on the BGA, some on the PCB, and some gone entirely. I don't have replacement solder balls or a stencil to…
MattHusz
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How can I fix a dry solder pin in a BGA package?

I am facing problem in a 16-bit transceiver chip, 74LVCHR16245AZQLR, which is a 56-pin BGA package. Its one data pin is not working as expected while all other pins are working OK. The problem pin is only sinking 6 mA of current while all other data…
alt-rose
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Missing pads allowed on BGA?

I'd like to use a 0.35mm BGA in a new design. If possible, I'd like to do this without resorting to an expensive manufacturing process with microvias. This is possible for my particular application, if I can pull a little trick. All of the pads I…
Rocketmagnet
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How to determine BGA land pad diameter for given ball diameter?

I'm working on a project which requires the use of a CSP package. The product's datasheet provides ball pitch in each axis as X:710um Y:580um and ball diameter as 250um but nothing about the preferred land pad diameter. How can the pad diameter be…
Stephen Pegoraro
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Non-wet open solder fault on the same ball of two different devices of the same part?

Sophisticated PCBA, with a DM6446 using two 16 bits DDR2 devices to implement a 32 bit memory space. On some boards, we see a stuck bit on either bit 24 or bit 8, which map to the same BGA ball (C8) on the two different devices. Of the known-bad…
John Sambrook
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