It seems like a lot of devices use an ARM SoC + a RAM chip + a flash storage chip. In applications that are very space-constrained, such as ChromeCast dongles, micro drones, or wristbands, it would be very useful to combine these 3 chips into 1 or 2.
Do you know of any solution that combines these three normally-separate chips into 1 package, through either die stacking or die-sharing or some other method, in order to dramatically reduce PCB area?
Thank you!