PCB thermal via design for qfn package

Question

How can I claculate how much via is required to dissipate a given amount of heat energy, for example my smd device case tmperature in datasheets says 80C, I used nearly 20C12 via 16 nos, but still the device is over heating, please let me kwow if there any calculation is there for via calculation for thermal pad.

See: http://electronics.stackexchange.com/questions/26783/how-do-i-determine-the-area-of-copper-needed-on-a-pcb-to-provide-adequate-heatsi/26791#26791 — dext0rb, Nov 23 '13 at 17:47

score 2 · Answer 1 · answered Nov 23 '13 at 08:10

2

Follow the IC recommended heatsink or supply enough info on heat source and sink in your question. Vias are not sinks, rather they are heat pipes to a heat sink.

answered Nov 23 '13 at 08:10

user33156

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PCB thermal via design for qfn package

1 Answers1