This question is from perspective of power integrity and not signal integrity. Power can be delivered from VRM to an IC using copper tracks and vias. Both of these have inductance and we want to minimize inductance. One to do this is to use decoupling capacitors and power planes. But in any case, from PDN PI perspective, what is worst, 1mm via or 1mm copper track?
Tracks and vias have different geometry. I am not sure if the same length of via and copper track have the same inductance. However, a geometry has affect on frequency response. This means that the signal attenuation will change for different frequency components. I am not sure if the response is worse for 1mm copper track or 1mm via.