What is the best stack-up design and layer order for 4-layer PCB? Signal/Ground/Core/Power/Signal is a good stack-up design? Or Ground/Signal-Power/Core/Signal-Power/Ground is better? Which is the best way?
And what should I think about the stack-up design? Which parameters are important for me? EMI/EMC issues important but is there any parameter important for 4-layer stack-up design?