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I would like to solder Coto reed switch CT10-2540-G1 upside down into a slot. It would recede into the slot until the tips of the lead touched the pads.

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Is there an IPC standard regarding the minimum pad coverage that would be required? I kept 0.3mm distance from the slot edge to the pad. I would like to make this smaller but my DRC flags anything less than 0.635mm and am hesitant to bring it any closer.

Null
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Kaari_layout
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    This could work, but consider a drop of mild adhesive in the cut-out for support; the solder bond will likely be weaker. – rdtsc Jul 06 '22 at 19:57
  • Careful about using adhesive *on the brittle glass enclosure* -- it depends on flexible leads to avoid cracking due to thermal cycling. – DrMoishe Pippik Jul 06 '22 at 23:17

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