I want to design a MOD PCB (daughter board,) to transform from QNF package to QFP package to use it on a existing/mother-board (just a reminder of the packages):
Picture taken from here.
My MOD PCB uses half plated through holes (PTH) on the edge of the board:
This is how it will look like on the mother-PCB:
Eurocircuits will not let me make such a board because the drill holes are too close to each other (I cannot make the drill holes less than 0.5 mm since they are on the edge of the PCB.)
With those limitations, the only thing left to do, is to use pads on the bottom of the mod PCB instead of drill holes/PTH.
The MOD PCB will be transformed into a SMD-QNF-style package. This is the new design:
Do you think that the solder paste will short circuits under the mod PCB?
Is there any rule of thumb to consider when designing the pads so that they won't short themselves?
Additional info:
Eurocircuits lets me make either 130 μm or 100 μm stencil height/depth (I will go with the 100μm one for the mother-PCB.)
MOD PCB: Copper clearance between the pads is 0.295 mm.
MOD PCB: Mask layer between the pads is 0.150 mm
MOD PCB: Each pad is 0.5 mm width
My question is kind of similar to this one but I am more worried about shorting the bottom pads, not the techniques used for daughter/motherboards.