I do not have the precise data, but I've worked in ASIC development on products that easily exceeded tens of millions of units in production.
Machines and technology are expensive in part because of the R&D that goes into it. But also in the precision required to make them.
One challenge is that the physical end precision required is smaller than the useable wavelength used during photolithography.
That requires special techniques relying on interferences to get the desired results. Those interferences are "planned" in the masks.
Also, at these precisions the masks must be so perfect that every artefact is effectively represented. A single interrupted line implies a missing connection, a missing transistor, etc. Precision impacts transistor properties, etc. Any single "error" is enough to not be able to produce the ASIC and you'ld find out after minimum one to two months if the error is undetected.
Making sure that every mask produced is "perfect" and so precise requires a bunch of R&D in many fields and high precision in building the machines that we need relatively few off.
You can put that into perspective with the fact that it is currently reported that a semiconductor fabrication facility costs up to 20 billion USD and 3 to 5 years to build (cutting edge technology).
Besides the masks, that also drives other costs up, in particular ASIC verification costs. Given the cost and delay in making the first prototype, design errors must also be avoided and that in itself also requires a lot of technology and engineering efforts.
So all that makes cutting edge technology only interesting for mass production. So that decreases the number of masks that are actually required in that technology which also drives the individual mask price cost up.