I am faced with two types of packaging:
- SOT 23
- SOT 23-3
Is there some difference between them?
Based an article in Wikipedia it seems like there are no differences.
I am faced with two types of packaging:
Is there some difference between them?
Based an article in Wikipedia it seems like there are no differences.
In the beginning of the surface mount era was SOT 23, which had three pins. It was used mainly to replace the very popular TO-18 and TO-92 3 pin leaded transistor packages, the name means Small Outline Transistor. As such, three pins in a triangular configuration was easy to read, as it echoed the three pin leaded package.
As densities increased, it was noticed that the SOT 23 had 'missing leads', and the package could be increased to up to 6 leads without increasing significantly the area it consumed. 5 leads was an especially useful package, as it permitted a single op-amp or single 2-input logic gate to be implemented. So SOT 23-5 and SOT 23-6 were born.
Where a manufacturer's data sheet covers only single transistors, they tend to use only the original SOT 23 designation. Where a manufacturer is providing (let's say) diodes, diode pairs and diode triples in 3 and 6 pin versions of the SOT 23 package, they'll sometimes refer to the 3 pin version as SOT 23-3 to distinguish it from the SOT 23-6, but sometimes just call it SOT 23. It's up to the manufacturer.
Note that SOT 23 and SOT 23-3 are just names, they don't have any definition. They have just entered the language through use and custom. JEDEC formally standardises dimensions, its TO-236AB package outline is the JEDEC title for what is known as SOT 23 and SOT 23-3.
SOT23-3
is the 3 pin variant of SOT23
. This is the most common variant.
Despite the upvotes, the previous answers are not 100% correct.
SOT23 and SOT23-3 look almost identical, and usually fit on the same footprint, but overall the SOT23-X packages are slightly larger than the plain SOT23. This is because the SOT23-X were intended for simple ICs like LDOs, although these days they are also often packaged in SOT23.
For example compare SOT23 and SOT23-3 versions of the AP2127 LDO made by Diodes Inc. Notably the body of the SOT23-3 (and other SOT23-X packages) is wider (1.6mm instead of 1.3mm) and taller (1.45mm vs. 1.1mm max). For many applications this doesn't matter, but if you are working on a tight layout with minimal pad size and component spacing or height restrictions it can cause issues.
Be aware that not all manufactures follow this convention. On top of that even if the base dimensions match the name, the tolerances and overall height can vary. I've seen heights anywhere from 1.0 and 1.5mm.