I have a flex circuit board with 5 LEDs mounted on it.
I have large copper areas attached to the LEDs for improved heat dissipation.
I read here that "With a hatched plane, the moisture can exit the flexible carrier material, whereas it is trapped under solid planes"
This is a different question because it involves LEDs that require solid copper areas for heat dissipation.
Since the copper areas are only on one side of the flex, should I still hatch the copper areas?
If hatching the areas is recommended, how can I calculate the required hatched area for heat dissipation?