I'd like to use a 0.35mm BGA in a new design. If possible, I'd like to do this without resorting to an expensive manufacturing process with microvias. This is possible for my particular application, if I can pull a little trick.
All of the pads I need for my application are around the perimeter of the chip, except one. The other internal pads I don't need. Perhaps I can just miss out the pad that's in the way of my track, and hope that the solder resist prevents a short.
Question: Is this a sensible thing to do?