I have been doing some research into the effectiveness of applying the 20H rule to 4 layer PCB designs and have been finding some very conflicting information. Some sources (including a few IEEE research papers and case studies) show experimental results that suggest that applying the 20H rule to a 2-plane stackup will actually increase edge radiation into free space, while other sources show evidence that it will cut emissions significantly. After doing some thinking about this, the pull-back on a power plane in respect to a ground plane is almost exactly the same as a microstrip. So my question is this, in a non-impedance controlled design, shouldn't adding a fairly continuous ground plane on the adjacent layer to the power plane make the power plane behave more like a stripline in regards to coupling to the sandwiching ground planes? Does anyone have a preferred method of cutting emissions in 4-layer designs apart from the usual mix of proper partitioning and slew control?
~~~~~~~~~~~~ Signal Layer Top
~~~~~~~~~~~~ Ground plane
~~~~~~~~ Power plane with 20H pullback
~~~~~~~~~~~~ Signal Layer Bottom w/Ground pour