I have been using EAGLE for some years. The boards I have designed had the following specs:
- up to 4 layers
- 6 mil spacing
- densest package: QFN, 0.4 mm pitch
- only "ordinary" vias
- mainly (low frequency) digital domain (CAN, IO, ...)
The new project has this specs:
- up to 10 (or even 12) layers
- densest package: 337-ball BGA (ARM-Cortext-R5)
- potentially blind and/or buried vias
My concern is: Is EAGLE sufficient for the new project? Or should I consider to switch to a more "advanced" PCB design tool, like Altium designer, Mentor Graphics PADS or Cadence Allegro?